Description

Flake copper powder is a type of copper powder with a flat, sheet-like structure. It has a smooth, flat surface, along with microscopic bumps or nanoscale surface structures. It is characterized by high purity, high aspect ratio, excellent electrical and thermal conductivity, and low resistance. This makes it suitable for partially replacing silver powder in the preparation of low-temperature polymer conductor pastes, conductive adhesives, etc., significantly reducing production costs.

The CuE series products are primarily used in industries such as powder metallurgy, conductive coatings, conductive pastes, electromagnetic interference (EMI) shielding materials, and chemical catalysts. In thermal conductive material applications, this product series can form more contact points and interfaces with other materials (such as substrates or other thermal conductive materials), thereby enhancing thermal conduction paths. In metal coating applications, its large surface area and flat shape effectively improve the coverage and adhesion of the coating, contributing to better protection of substrate materials, and resistance against corrosion and physical wear. In EMI shielding material applications, the high surface area and conductive properties of the CuE series products help to form continuous conductive paths on and within the material, blocking and reflecting electromagnetic waves, effectively enhancing the material's shielding performance.

Characteristics