The CuM series product is a high-purity, smooth-surfaced, nearly spherical metal powder. Its shape enhances product flowability and dispersibility, allowing for uniform distribution across various media. This series of products features excellent electrical and thermal conductivity, small particle size, non-agglomeration, broad particle size distribution, and dense, non-porous powder characteristics. It is widely used in the manufacturing of aerospace engine combustion chamber components, heat exchangers, metal injection molding (MIM), additive manufacturing (AM), multilayer ceramic capacitors (MLCC), and powder metallurgy industries.
The copper electrode paste for MLCCs, composed of CuM series products, glass powder, and organic carriers, is a red paste-like fluid, lead-free, and environmentally friendly. CuM series copper powders have excellent conductivity and dispersibility, significantly improving the conductivity of copper terminal electrode pastes and the density of sintered products. The paste has a viscosity of 20-33Pa·s, and the fineness is≤8.0μm, ensuring flowability and uniformity during printing and coating processes. After sintering, the copper layer is tightly bonded to the ceramic body, with strong adhesion and excellent conductivity.
Grade |
Apparent Density (g/cm³) |
Tap Density (g/cm3) |
Flow Rate (s/50g) |
O2 Cont. (wt%) |
Sieve Analysis(μm) |
||
D10 | D50 | D90 | |||||
CuM-10 |
4.5-5.5 | 4.5-5.5 | 15.5 | 0.1 max | - | 8 | 10 |
CuM-20 | 20 | ||||||
CuM-30 | 30 |
Laser additive manufacturing, represented by Selective Laser Melting (SLM), offers advantages such as high design flexibility and precision. The CuM series products have unique advantages in the preparation of complex-shaped, uniformly structured, high-density, and high-performance components, as well as heat sink and dissipation parts. These advantages include excellent sintering activity, high sintering density, ease of injection molding, and low deformation during debinding.
Typical part properties* |
Yield strength (MPa) |
Tensile strength (MPa) |
Elongation at break (%) |
Mechanical properties as manufacture |
180 | 200 | 5 |
Mechanical properties heat treated |
140 |
190 | 20 |
Conductivity as manufacture |
>80% IACS | - | - |
Conductivity heat treated |
>90% IACS |
- | - |
*Copper can be heat treated to reach different mechanical properties and conductivity values. Properties in the table have been achieved with following heat-treatment:
Hold 1 h at ~ 1,000℃ in argon atmosphere, slow cooling with argon
Copper and its alloys have high conductivity; hence high power is required for processing. The achieved density, which influences the mechanical properties, is typical for a 400 W laser.